Molybdenum Copper

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Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.

Properties for MoCu composites

Composition Mo wt% Cu wt% Density g/cm3 Thermal conductivity
W/(M.K)
CTE (10-6/K)
Mo85Cu15 85 ± 2 Balance 10 160 – 180 6.8
Mo80Cu20 80 ± 2 Balance 9.9 170 – 190 7.7
Mo70Cu30 70 ± 2 Balance 9.8 180 – 200 9.1
Mo60Cu40 60 ± 2 Balance 9.66 210 – 250 10.3
Mo50Cu50 50 ± 2 Balance 9.54 230 – 270 11.5

The most important usage of MoCu is heat sinks for electronic devices. We can also provide Mo/Cu/Mo, Mo/CuMo/Mo parts. Visit our Heat sinks page for more information.

Besides MoCu and (Tungsten copper) WCu heat sinks, we can also provide pure Moly, Cu-Mo-Cu Heat Sinks, Molybdenum-Copper-Molybdenum products, Cu-MoCu-Cu parts.

Cu-Mo-Cu (CMC materials) Heat Sinks Specification:

Cu: Mo: Cu (Thick ratio) Density (g/cc) Coefficient of Thermal Expansion (10-6/K) Thermal Conductivity (W/m·K), x-y direction Thermal Conductivity (W/m·K), x-z direction
1:1:1 9.4 9.4 300~310 240~250
1:2:1 9.6 7.7 260~270 210~220
1:3:1 9.7 6.9 230~240 190~200
1:4:1 9.8 6.2 210~220 170~180
13:74:13 9.9 5.8 190~200 160~170

Cu-Mo70Cu-Cu ( CPC material) Heat Sinks Specification:

Cu-Mo70Cu-Cu
(Thick ratio)
Density (g/cc) Coefficient of Thermal Expansion (10-6/K) Thermal Conductivity (W/m·K)
Plate direction Thick direction Plate direction Thick direction
1:4:1 9.46 7.2 9.0 250-300 210-250

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