Coefficient of thermal expansion (CTE) of molybdenum copper can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.
Properties for MoCu composites
| Composition | Mo wt% | Cu wt% | Density g/cm3 | Thermal conductivity W/(M.K) |
CTE (10-6/K) |
| Mo85Cu15 | 85 ± 2 | Balance | 10 | 160 – 180 | 6.8 |
| Mo80Cu20 | 80 ± 2 | Balance | 9.9 | 170 – 190 | 7.7 |
| Mo70Cu30 | 70 ± 2 | Balance | 9.8 | 180 – 200 | 9.1 |
| Mo60Cu40 | 60 ± 2 | Balance | 9.66 | 210 – 250 | 10.3 |
| Mo50Cu50 | 50 ± 2 | Balance | 9.54 | 230 – 270 | 11.5 |
The most important usage of MoCu is heat sinks for electronic devices. We can also provide Mo/Cu/Mo, Mo/CuMo/Mo parts. Visit our Heat sinks page for more information.
Besides MoCu and (Tungsten copper) WCu heat sinks, we can also provide pure Moly, Cu-Mo-Cu Heat Sinks, Molybdenum-Copper-Molybdenum products, Cu-MoCu-Cu parts.
Cu-Mo-Cu (CMC materials) Heat Sinks Specification:
| Cu: Mo: Cu (Thick ratio) | Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K), x-y direction | Thermal Conductivity (W/m·K), x-z direction |
|---|---|---|---|---|
| 1:1:1 | 9.4 | 9.4 | 300~310 | 240~250 |
| 1:2:1 | 9.6 | 7.7 | 260~270 | 210~220 |
| 1:3:1 | 9.7 | 6.9 | 230~240 | 190~200 |
| 1:4:1 | 9.8 | 6.2 | 210~220 | 170~180 |
| 13:74:13 | 9.9 | 5.8 | 190~200 | 160~170 |
Cu-Mo70Cu-Cu ( CPC material) Heat Sinks Specification:
| Cu-Mo70Cu-Cu (Thick ratio) |
Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K) | ||
| Plate direction | Thick direction | Plate direction | Thick direction | ||
| 1:4:1 | 9.46 | 7.2 | 9.0 | 250-300 | 210-250 |
RELATED PRODUCTS
Edgetech Industries LLC is a global provider of marker bands (radiopaque markers) for the medical device manufacturing industry.